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FOD817ASD bảng dữ liệu(PDF) 2 Page - List of Unclassifed Manufacturers

tên linh kiện FOD817ASD
Giải thích chi tiết về linh kiện  AC input response (FOD814 only), Applicable to Pb-free IR reflow soldering
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nhà sản xuất  ETC2 [List of Unclassifed Manufacturers]
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FOD817ASD bảng dữ liệu(HTML) 2 Page - List of Unclassifed Manufacturers

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©2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FOD814 Series, FOD817 Series Rev. 1.1.5
2
Absolute Maximum Ratings (T
A = 25°C Unless otherwise specified.)
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Value
Units
FOD814
FOD817
TOTAL DEVICE
TSTG
Storage Temperature
-55 to +150
°C
TOPR
Operating Temperature
-55 to +105
-55 to +110
°C
TSOL
Lead Solder Temperature
260 for 10 sec
°C
TJ
Junction Temperature
125 Max.
°C
θJC
Junction-to-Case Thermal Resistance
210
°C/W
PTOT
Total Power Dissipation
200
mW
EMITTER
IF
Continuous Forward Current
±50
50
mA
VR
Reverse Voltage
6
PD
Power Dissipation
Derate above 100°C
70
1.7
mW
mW/°C
DETECTOR
VCEO
Collector-Emitter Voltage
70
V
VECO
Emitter-Collector Voltage
6
V
IC
Continuous Collector Current
50
mA
PC
Collector Power Dissipation
Derate above 90°C
150
2.9
mW
mW/°C



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