LM7301 datasheet(2/22 Pages) TI

2 / 22 page

LM7301

SNOS879H – AUGUST 1999 – REVISED MARCH 2013

www.ti.com

Gain and Phase,

Gain and Phase

2.7V Supply

Figure 3.

Figure 4.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Value

Unit

ESD Tolerance(3)

Human Body Model

2500

Differential Input Voltage

Voltage at Input/Output Pin

(V+) + 0.3V, (V−)

−0.3

Supply Voltage (V+

− V−)

Current at Input Pin

±10

Current at Output Pin(4)

±20

Current at Power Supply Pin

Soldering Information: http://www.ti.com/lit/an/snoa549c/snoa549c.pdf

Storage Temperature Range

−65°C to +150

°C

Junction Temperature(5)

150

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Human Body Model, applicable std. MIL-STD-883, Method 3015.7.

(4)

Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in

exceeding the maximum allowed junction temperature of 150°C.

(5)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly into a PC board.

Operating Ratings

(1)

Value

Unit

Supply Voltage

1.8

≤ VS ≤ 32

Operating Temperature Range(2)

−40 to +85

°C

Package Thermal Resistance (

θJA)

(2)

5-Pin SOT-23

325

°C/W

8-Pin SOIC

165

°C/W

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX) − TA)/θJA. All numbers apply for packages soldered directly into a PC board.

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