LM1086CS-3.3SLASHNOPB datasheet(3/24 Pages) TI1

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LM1086

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SNVS039H – JUNE 2000 – REVISED MAY 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Maximum Input-to-Output Voltage Differential

LM1086-ADJ

29V

LM1086-1.8

27V

LM1086-2.5

27V

LM1086-2.85

27V

LM1086-3.3

27V

LM1086-3.45

27V

LM1086-5.0

25V

Power Dissipation (3)

Internally Limited

Junction Temperature (TJ)

(4)

150°C

Storage Temperature Range

-65°C to 150°C

Lead Temperature

260°C, to 10 sec

ESD Tolerance (5)

2000V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Power dissipation is kept in a safe range by current limiting circuitry. Refer to OVERLOAD RECOVERY in Application Note. The value

θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of thermal vias. For improved

thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401).

(4)

The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations in the Application Notes.

(5)

For testing purposes, ESD was applied using human body model, 1.5k

Ω in series with 100pF.

Operating Ratings

(1)

Junction Temperature Range (TJ)

(2)

Control Section

0°C to 125°C

"C" Grade

Output Section

0°C to 150°C

Control Section

−40°C to 125°C

"I" Grade

Output Section

−40°C to 150°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test

conditions, see the Electrical Characteristics.

(2)

The maximum power dissipation is a function of TJ(MAX) , θJA, and TA. The maximum allowable power dissipation at any ambient

temperature is PD = (TJ(MAX)–T A)/θJA. All numbers apply for packages soldered directly into a PC board. Refer to Thermal

Considerations in the Application Notes.

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