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ACPL-W341-500E bảng dữ liệu(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED

tên linh kiện ACPL-W341-500E
Giải thích chi tiết về linh kiện  3.0 Amp Output Current IGBT Gate Drive Optocoupler with Rail-to-Rail Output Voltage in Stretched SO6
PDF  19 Pages
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nhà sản xuất  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Trang chủ  http://www.avagotech.com
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ACPL-W341-500E bảng dữ liệu(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED

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Table 2. Insulation and Safety Related Specifications
Parameter
Symbol
ACPL-P341
ACPL-W341
Units
Conditions
Minimum External Air Gap
(External Clearance)
L(101)
7.0
8.0
mm
Measured from input terminals to output
terminals, shortest distance through air.
Minimum External Tracking
(External Creepage)
L(102)
8.0
8.0
mm
Measured from input terminals to output
terminals, shortest distance path along body.
Minimum Internal Plastic Gap
(Internal Clearance)
0.08
0.08
mm
Through insulation distance conductor to
conductor, usually the straight line distance
thickness between the emitter and detector.
Tracking Resistance
(Comparative Tracking Index)
CTI
>175
>175
V
DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Notes:
1. All Avago data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting
point for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board,
minimum creepage and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest distance
path along the surface of a printed circuit board between the solder fillets of the input and output leads must be considered (the recommended
Land Pattern does not necessarily meet the minimum creepage of the device). There are recommended techniques such as grooves and ribs which
may be used on a printed circuit board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending
on factors such as pollution degree and insulation level.
Table 3. Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Note
Storage Temperature
TS
-55
125
°C
Operating Temperature
TA
-40
105
°C
Output IC Junction Temperature
TJ
125
°C
Average Input Current
IF(AVG)
25
mA
1
Peak Transient Input Current
(<1
s pulse width, 300 pps)
IF(TRAN)
1A
Reverse Input Voltage
VR
5V
“High” Peak Output Current
IOH(PEAK)
3.0
A
2
“Low” Peak Output Current
IOL(PEAK)
3.0
A
2
Total Output Supply Voltage
(VCC - VEE)
035
V
Input Current (Rise/Fall Time)
tr(IN) / tf(IN)
500
ns
Output Voltage
VO(PEAK)
-0.5
VCC
V
Output IC Power Dissipation
PO
700
mW
3
Total Power Dissipation
PT
745
mW
4
Lead Solder Temperature
260° C for 10 sec., 1.6 mm below seating plane
Table 4. Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Note
Operating Temperature
TA
-40
105
°C
Output Supply Voltage
(VCC - VEE)
1530V
Input Current (ON)
IF(ON)
716
mA
Input Voltage (OFF)
VF(OFF)
-3.6
0.8
V



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