OMAP3530ECBC72 datasheet(8/264 Pages) TI1

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Contents

OMAP3530/25 Applications Processor

SPRS507F – FEBRUARY 2008 – REVISED OCTOBER 2009

www.ti.com

OMAP3530/25 Applications Processor

.............. 1

4.3

DPLL and DLL Specifications

...................... 141

1.1

Features

.............................................. 1

VIDEO DAC SPECIFICATIONS

..................... 147

1.2

Description

............................................ 4

5.1

Interface Description

............................... 147

5.2

Electrical Specifications Over Recommended

1.3

Functional Block Diagram

............................ 7

Operating Conditions

.............................. 149

Revision History

............................................... 9

5.3

Analog Supply (vdda_dac) Noise Requirements

.. 151

TERMINAL DESCRIPTION

............................ 10

5.4

External Component Value Choice

................ 152

2.1

Terminal Assignment

................................ 10

TIMING REQUIREMENTS AND SWITCHING

2.2

Pin Assignments

.................................... 14

CHARACTERISTICS

.................................. 153

2.3

Ball Characteristics

.................................. 27

6.1

Timing Test Conditions

............................ 153

2.4

Multiplexing Characteristics

......................... 86

6.2

Interface Clock Specifications

..................... 153

2.5

Signal Description

................................... 94

6.3

Timing Parameters

................................. 154

ELECTRICAL CHARACTERISTICS

................ 119

6.4

External Memory Interfaces

........................ 155

3.1

Power Domains

.................................... 119

6.5

Video Interfaces

.................................... 184

3.2

Absolute Maximum Ratings

........................ 121

6.6

Serial Communications Interfaces

................. 201

3.3

Recommended Operating Conditions

............. 123

6.7

Removable Media Interfaces

...................... 234

3.4

DC Electrical Characteristics

....................... 125

6.8

Test Interfaces

..................................... 249

3.5

Core Voltage Decoupling

.......................... 128

PACKAGE CHARACTERISTICS

.................... 255

3.6

Power-up and Power-down

........................ 130

7.1

Package Thermal Resistance

...................... 255

CLOCK SPECIFICATIONS

........................... 133

7.2

Device Support

..................................... 255

4.1

Input Clock Specifications

......................... 134

4.2

Output Clock Specifications

........................ 139

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