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EvaluationBoard bảng dữ liệu(PDF) 5 Page - Intersil Corporation |
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EvaluationBoard bảng dữ liệu(HTML) 5 Page - Intersil Corporation |
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5 / 16 page ![]() ISL75052SEH 5 FN8456.0 May 29, 2013 Absolute Maximum Ratings Thermal Information VIN Relative to GND without ion beam (Note 2) . . . . . . . . . . -0.3 to +16.0V VIN Relative to GND under ion beam (Note 2) . . . . . . . . . . . -0.3 to +14.7V VOUT Relative to GND (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +14.7V PG,EN,OCP/ADJ,COMP,REFIN,REFOUT relative to GND (Note 2) . . . -0.3 to +6.5VDC Recommended Operating Conditions (Notes 3) Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . .-55°C to +125°C Junction Temperature (TJ) (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . .+150°C VIN Relative to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0V to 13.2V VOUT Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.5V to 12.7V PG, EN, OCP/ADJ relative to GND . . . . . . . . . . . . . . . . . . . . . . . .0V to +5.5V Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 16 Ld CDFP Package (Notes 5, 6) . . . . . . . 26 4.5 Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Radiation Information Maximum Total Dose High Dose(Dose Rate = 50 - 300radSi/s) . . . . . . . . . . . .100 krads (Si) Low Dose(Dose Rate = 10milliradSi/s) (Note 4) . . . . . . 100 krads (Si) SET (VOUT within ±5% During Events . . . . . . . . . . . . . . . .86MeV/mg/cm2 SEL/B (No Latchup/Burnout . . . . . . . . . . . . . . . . . . . . . . . . 86MeV/mg/cm2 The output capacitance used for SEE testing is 2x100µF for CIN and COUT, 100nF for BYPASS CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 2. Extended operation at these conditions may compromise reliability. Exceeding these limits will result in damage. Recommended operating conditions define limits where specifications are guaranteed. 3. Refer to “Bottom Metal Mounting Guidelines” on page 8. 4. Product capability established by initial characterization. The "EH" version is acceptance tested on a wafer by wafer basis to 50 krad(Si) at low dose rate. 5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See TechBrief TB379 6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 7. Electromigration specification defined as lifetime average junction temperature of +150°C where max rated DC current = lifetime average current. Electrical Specifications Unless otherwise noted, all parameters are guaranteed over the following specified conditions: VIN =VOUT +0.5V, VOUT = 4.0V, CIN = COUT = 2x100µF 60mΩ, KEMET type T541X107N025AH or equivalent, TJ = +25°C, IL = 0A. Applications must follow thermal guidelines of the package to determine worst case junction temperature. Please refer to “Applications Information” on page 7 of the data sheet and Tech Brief TB379. Boldface limits apply over the operating temperature range, -55°C to +125°C. Pulse load techniques used by ATE to ensure TJ =TA defines guaranteed limits. PARAMETER SYMBOL TEST CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNITS DC CHARACTERISTICS DC Output Voltage Accuracy VOUT VOUT Resistor adjust to: 2.5V and 5.0V VOUT = 2.5V, 4.0V < VIN < 5.0V; 0A < ILOAD < 1.5A, TJ = -55°C to +125°C -1.5 0.2 1.5 % VOUT = 2.5V, 4.0V < VIN < 5.0V; 0A < ILOAD < 1.5A, TJ = +25°C, Post Rad. -2.0 0.2 2.0 % VOUT = 5.0V, 5.5V < VIN < 6.9V; 0A < ILOAD < 1.5A, TJ = -55°C to +125°C -1.5 0.2 1.5 % VOUT = 5.0V, 5.5V < VIN < 6.9V, 0A < ILOAD < 1.5A, TJ = +25°C, Post Rad. -2.0 0.2 2.0 % VOUT Resistor adjust to: 10.0V VOUT = 10.0V, 10.5V < VIN < 13.2V, ILOAD = 0A, TJ =-55°C to +125°C -1.5 0.2 1.5 % VOUT = 10.0V, 10.5V < VIN < 13.2V, ILOAD = 0A, TJ = +25°C, Post Rad. -2.0 0.2 2.0 % VOUT = 10.0V, VIN = 10.5V, ILOAD = 1.5A, VIN =13.2V, ILOAD = 1.0A, TJ = -55°C to +125°C -1.5 0.2 1.5 % VOUT = 10.0V, VIN = 10.5V; ILOAD =1.5A, VIN =13.2V, ILOAD = 1.0A, TJ = +25°C, Post Rad. -2.0 0.2 2.0 % |
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