Data Sheet

ADP5050

Rev. 0 | Page 57 of 60

OUTLINE DIMENSIONS

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

48

13

24

36

37

EXPOSED

PAD

PIN 1

INDICATOR

*5.65

5.60 SQ

5.55

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.203 REF

COPLANARITY

0.08

0.30

0.25

0.20

7.10

7.00 SQ

6.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.20 MIN

*COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-2

WITH THE EXCEPTION OF THE EXPOSED PAD DIMENSION.

Figure 69. 48-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

7 mm × 7 mm Body, Very Very Thin Quad

(CP-48-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option2

ADP5050ACPZ-R7

−40°C to +125°C

48-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-48-13

ADP5050-EVALZ

Evaluation Board

1

Z = RoHS Compliant Part.

2

Table 65 lists the factory default options for the device. For a list of factory programmable options, see the Factory Programmable Options section. To order a device

with options other than the default options, contact your local Analog Devices sales or distribution representative.