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SP720APP bảng dữ liệu(PDF) 5 Page - Littelfuse |
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SP720APP bảng dữ liệu(HTML) 5 Page - Littelfuse |
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5 / 6 page ![]() 59 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™Family of Products) Revision: April 14, 2011 SP720 Lead-Free/Green Series General Purpose ESD Protection - SP720 Series Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (T s(min)) 150°C - Temperature Max (T s(max)) 200°C - Time (min to max) (t s) 60 – 180 secs Average ramp up rate (Liquidus) Temp (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow - Temperature (T L) (Liquidus) 217°C - Temperature (t L) 60 – 150 seconds Peak Temperature (T P) 250+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peak Temperature (T P) 8 minutes Max. Do not exceed 260°C Soldering Parameters C L E eA C eB eC -B- E1 INDEX 1 2 3 N/2 N AREA SEATING BASE PLANE PLANE -C- D1 B1 B e D D1 A A2 L A1 -A- 0.010 (0.25)C A M BS Package PDIP Pins 16 Lead Dual-in-Line JEDEC E16.3 MS-001-BB Issue D Millimeters Inches Notes Min Max Min Max A - 5.33 - 0.210 4 A1 0.39 - 0.015 - 4 A2 2.93 4.95 0.115 0.195 - B 0.356 0.558 0.014 0.022 - B1 1.15 1.77 0.045 0.070 8, 10 C 0.204 0.355 0.008 0.014 - D 18.66 19.68 0.735 0.775 5 D1 0.13 - 0.005 - 5 E 7.62 8.25 0.300 0.325 6 E1 6.10 7.11 0.240 0.280 5 e 2.54 BSC 0.100 BSC - e A 7.62 BSC 0.300 BSC 6 e B - 10.92 - 0.430 7 L 2.93 3.81 0.115 0.150 4 N 16 16 9 Notes: 1. Controlling Dimensions: INCH. in case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JE-DEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and e A are measured with the leads constrained to be perpendicular to datum -C- . 7. e B and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). Package Dimensions Dual-In-Line Plastic Packages (PDIP) |
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