SSC

SSC--STW8C2SA

STW8C2SA

Jan 2013

Jan 2013

www.seoulsemicon.com

www.seoulsemicon.com

SSC-QP-7-07-12 (Rev.01)

(1) During processing, mechanical stress on the surface should be minimized as much as possible.

Sharp objects of all types should not be used to pierce the sealing compound.

(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs

without a silicone sealant, since the surface can also become scratched.

(3) When populating boards in SMT production, there are basically no restrictions regarding the form of

the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented.

This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.

(4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions

must be considered during the handling of such devices. Compared to standard encapsulants,

silicone is generally softer, and the surface is more likely to attract dust.

As mentioned previously, the increased sensitivity to dust requires special care during processing.

In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution

must be applied to the surface after the soldering of components.

(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured

that these solvents do not dissolve the package or resin.

Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.

(6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this.

product with acid or sulfur material in sealed space.

12. Handling of Silicone Resin LEDs