SMP04EP datasheet(3/15 Pages) AD

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SMP04

–3–

REV. D

ABSOLUTE MAXIMUM RATINGS

(TA = +25°C unless otherwise noted)

VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, 17 V

VDD to VSS

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.7 V, 17 V

VLOGIC to DGND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, VDD

VIN to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD

VOUT to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS, VDD

Analog Output Current . . . . . . . . . . . . . . . . . . . . . . .

±20 mA

(Not Short-Circuit Protected)

Digital Input Voltage to DGND . . . . . . . –0.3 V, VDD + 0.3 V

Operating Temperature Range

EQ, EP, ES . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150

°C

Storage Temperature . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

Package Type

JA*

Units

16-Lead Cerdip

°C/W

16-Lead Plastic DIP

°C/W

16-Lead SO

°C/W

* JA is specified for worst case mounting conditions, i.e., JA is specified for device

in socket for cerdip and plastic DIP packages; JA is specified for device soldered

to printed circuit board for SO package.

CAUTION

1. Stresses above those listed under Absolute Maximum Ratings may cause

permanent damage to the device. This is a stress rating only; function operation

at or above this specification is not implied. Exposure to the above maximum

rating conditions for extended periods may affect device reliability.

2. Digital inputs and outputs are protected; however, permanent damage may

occur on unprotected units from high energy electrostatic fields. Keep units in

conductive foam or packaging at all times until ready to use. Use proper antistatic

handling procedures.

3. Remove power before inserting or removing units from their sockets.

ORDERING GUIDE

Temperature

Package

Model

Range

Description

Options*

SMP04EQ

–40

°C to +85°C

Cerdip-16

Q-16

SMP04EP

–40

°C to +85°C

PDIP-16

N-16

SMP04ES

–40

°C to +85°C

SO-16

R-16A

*Q = Cerdip; N = Plastic DIP; R = Small Outline.

PIN CONNECTIONS

16-Lead Cerdip

16-Lead Plastic DIP

16-Lead SO

TOP VIEW

(Not to Scale)

SMP04

NC = NO CONNECT

VOUT2

VSS

VOUT4

VOUT3

VDD

VOUT1

VIN1

S/H4

VIN3

VIN4

VIN2

S/H1

S/H2

DGND

S/H3

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the SMP04 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

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