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ADP3152 bảng dữ liệu(PDF) 9 Page - Analog Devices |
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ADP3152 bảng dữ liệu(HTML) 9 Page - Analog Devices |
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9 / 12 page ![]() ADP3152 –9– REV. 0 The minimum input voltage dictates whether standard threshold or logic-level threshold MOSFETs must be used. For VIN > 8 V, standard threshold MOSFETs (VGS(TH) < 4 V) may be used. If VIN is expected to drop below 8 V, logic-level threshold MOSFETs (VGS(TH) < 2.5 V) are strongly recommended. Only logic-level MOSFETs with VGS ratings higher than the absolute maximum of VCC should be used. The maximum output current IOMAX determines the RDS(ON) requirement for the two power MOSFETs. When the ADP3152 is operating in continuous mode, the simplifying assumption can be made that one of the two MOSFETs is always conducting the average load current. For VIN = 5 V and VO = 2.8 V, the maximum duty ratio of the high side FET is: DMAXHF = (1–fMIN × t OFF) =(1–160 kHz × 2.2 µs) = 65% The maximum duty ratio of the low side (synchronous rectifier) FET is: DMAXLF = 1 – DMAXHF = 35% The maximum rms current of the high side FET is: IRMSLS = [DMAXHF (ILVALLEY 2 + I LPEAK 2 + I LVALLEYILPEAK)/3] 0.5 = 11.5 Arms The maximum rms current of the low side FET is: IRMSLS = [DMAXLF (ILVALLEY 2 + I LPEAK 2 + I LVALLEYILPEAK)/3] 0.5 = 8.41 Arms The RDS(ON) for each FET can be derived from the allowable dissipation. If we allow 5% of the maximum output power for FET dissipation, the total dissipation will be: PFETALL = 0.05 VOIOMAX = 2 W Allocating two-thirds of the total dissipation for the high side FET and one-third for the low side FET, the required minimum FET resistances will be: RDS(ON)HSF(MIN) = 1.33/11.5 2 = 10 m Ω RDS(ON)LSF(MIN) = 0.67/8.41 2 = 9.5 m Ω Note that there is a tradeoff between converter efficiency and cost. Larger FETs reduce the conduction losses and allow higher efficiency but lead to increased cost. If efficiency is not a major concern the Fairchild MOSFET NDP6030L or International Rectifier IRL3103 is an economical choice for both the high side and low side positions. Those devices have an RDS(ON) of 14 m Ω at VGS = 10 V and at 25 °C. The low side FET is turned on with at least 10 V. The high side FET, however, is turned on with only 12 V – 5 V = 7 V. If we check the typical output character- istics of the device in the data sheet, we find that for an output current of 10 A, and at a VGS of 7 V, the VDS is 0.15 V, which gives a RDS(ON) = VDS/ID = 15 m Ω. This value is only slightly above the one specified at a VGS of 10 V, so the resistance in- crease due to the reduced gate drive can be neglected. We have to modify, however, the specified RDS(ON) at the expected high- est FET junction temperature of 140 °C by a R DS(ON) multiplier, using the graph in the data sheet. In our case: RDS(ON)MULT = 1.7 Using this multiplier, the expected RDS(ON) at 140 °C is 1.7 × 14 = 24 m Ω. The high side FET dissipation is: PDFETHS = IRMSHS 2R DS(ON) + 0.5 VINILPEAKQGfMAX/IG = 3.72 W where the second term represents the turn-off loss of the FET. (In the second term, QG is the gate charge to be removed from the gate for turn-off and IG is the gate current. From the data sheet, QG is about 50 nC –70 nC and the gate drive current provided by the ADP3152 is about 1 A.) The low side FET dissipation is: PDFETLS = IRMSLS 2R DS(ON) = 1.7 W (Note that there are no switching losses in the low side FET.) To remove the dissipation of the chosen FETs, proper heatsinks should be used. The Thermalloy 6030 heatsink has a thermal impedance of 13 °C/W with convection cooling. With this heat- sink, the junction-to-ambient thermal impedance of the chosen high side FET θ JAHS will be 13 (heatsink-to-ambient) + 2 (junc- tion-to-case) + 0.5 (case-to-heatsink) = 15.5 °C/W. At full load and at 50 °C ambient temperature, the junction temperature of the high side FET is: TJHSMAX = TA + θJAHS PDFETHS = 105°C A smaller heatsink may be used for the low side FET, e.g., the Thermalloy type 7141 ( θ = 20.3°C/W). With this heatsink, the thermal impedance θ JALS for the low side FET = 33.8 °C/W. The low side FET junction temperature is: TJLSMAX = TA + θJALS PDFETLS = 106°C All of the above calculated junction temperatures are safely below the 175 °C maximum specified junction temperature of the selected FET. The maximum operating junction temperature of the ADP3152 is calculated as follows: TJICMAX = TA + θJA (IICVCC + PDR) where θ JA is the junction to ambient thermal impedance of the ADP3152 and PDR is the drive power. From the data sheet, θ JA is equal to 110 °C/W and I IC = 2.7 mA. PDR can be calculated as follows: PDR = (CRSS + CISS)VCC 2 f MAX = 307 mW The result is: TJICMAX = 86°C |
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