WM8988 datasheet(55/56 Pages) WOLFSON

55 / 56 page

Production Data

WM8988

PD, Rev 4.0, October 2008

PACKAGE DIMENSIONS

DM050.B

FL: 28 PIN COL QFN PLASTIC PACKAGE 4 X 4 X 0.55 mm BODY, 0.45 mm LEAD PITCH

INDEX AREA

(D/2 X E/2)

TOP VIEW

NOTES:

1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.

2. ALL DIMENSIONS ARE IN MILLIMETRES.

3. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.

4. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.

5. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.

6. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.

DETAIL 1

bbb M

BOTTOM VIEW

aaa

2 X

aaa

2 X

SEATING PLANE

DETAIL 2

0.08

ccc

SIDE VIEW

DETAIL 1

Datum

DETAIL 2

Terminal

Tip

e/2

SEE DETAIL 2

Exposed lead

DETAIL 2

Dimensions (mm)

Symbols

MIN

NOM

MAX

NOTE

0.500

0.550

0.600

0.05

0.025

0.152 REF

0.28

0.18

4.00

0.45 BSC

0.40 REF

4.00

0.10

aaa

bbb

ccc

REF:

0.15

0.10

JEDEC, MO-220

Tolerances of Form and Position

0.23

0.076 REF

0.535 REF

0.076 REF

0.230 REF

0.05 REF

3.95

4.05

3.95

4.05

PIN 1

IDENTIFICATION

0.150MM SQUARE

0.275MM

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