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SPC56EC74L7 bảng dữ liệu(PDF) 72 Page - STMicroelectronics |
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SPC56EC74L7 bảng dữ liệu(HTML) 72 Page - STMicroelectronics |
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72 / 118 page ![]() Electrical Characteristics SPC564Bxx - SPC56ECxx 72/118 Doc ID 17478 Rev 4 4.10.3 Flash memory start-up/switch-off timings 4.11 Electromagnetic compatibility (EMC) characteristics Susceptibility tests are performed on a sample basis during product characterization. 4.11.1 Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user apply EMC software optimization and pre- qualification tests in relation with the EMC level requested for the application. ● Software recommendations − The software flowchart must include the management of runaway conditions such as: – Corrupted program counter – Unexpected reset – Critical data corruption (control registers) ● Pre-qualification trials − Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the reset pin or the oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note Software Techniques For Improving Microcontroller EMC Performance (AN1015)). Table 31. Start-up time/Switch-off time Symbol C Parameter Conditions (1) Value Unit Min Typ Max TFLARSTEXIT CC D Delay for flash memory module to exit reset mode Code flash memory — —— 125 µs Data flash memory —— TFLALPEXIT CC T Delay for flash memory module to exit low-power mode Code flash memory —— — 0.5 TFLAPDEXIT CC T Delay for flash memory module to exit power-down mode Code flash memory — —— 30 Data flash memory —— TFLALPENTRY CC T Delay for flash memory module to enter low-power mode Code flash memory —— — 0.5 1. VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = −40 to 125 °C, unless otherwise specified. |
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