+

+

+

Vin-12v

Boost

V-boost1

V-boost2

V-boost6

1A

1B

3B

I-Led6

I-Led2

I-Led1

F28027

3V3

Comms

CPU

32 bit

DSP core

60 MHz

I C

SPI

UART

2

ADC

12 bit

4.6 MSPS

I-Led1

I-Led2

I-Led8

V-boost1

V-boost6

V-sepic1

V-sepic2

1A / 1B

2A / 2B

3A / 3B

4A / 4B

PWM1

(HR)

PWM2

(HR)

PWM3

(HR)

PWM4

(HR)

Vref

Hardware Overview

www.ti.com

Figure 3. LED BoosterPack Circuit Diagram

3.1

Subsystems

The LED BoosterPack board is divided into functional groups referred to as subsystems. The following is a

list of the subsystems present on the board and brief descriptions of each:

•

stepped down using the Buck regulator to generate 5 V. The 5 V is used to power a 3.3 V LDO that

supplies power to the 3.3 V device present on the BoosterPack. Both the 3.3 V and 5 V power

domains can be selectively jumpered (via J2 and J8, respectively) to supply power to the

LaunchPadXL headers.

•

enough to forward bias the LEDs. The boost converters are driven by the EPWM peripheral present on

the F28027 device on the C2000 LaunchPad™.

•

current into a voltage that can be measured. The voltage from the sense resistors is passed to a set of

op-amps to amplify and filter the current feedback signal. They also serve the purpose of driving the

analog-to-digital converter (ADC) inputs.

•

that a Capacitive Touch BoosterPack can be plugged into the LED BoosterPack and used to control

the LEDs. Switch S1 can be used to connect or disconnect the MSP430’s serial peripheral to the

F28027 device’s serial peripheral present on the C2000 LaunchPad. If the user wishes to use the

capacitive touch demo, ensure S1 is in the up position while S4 on the LaunchPad is in the down

position.

–

Advanced users can reprogram the MSP430 present on the LED BoosterPack by using J5.

6

C2000 LED BoosterPack

SPRUHH9 – July 2012

Submit Documentation Feedback

Copyright © 2012, Texas Instruments Incorporated