STM32F051K4 datasheet(99/104 Pages) STMICROELECTRONICS

tên linh kiện	STM32F051K4

Giải thích chi tiết về linh kiện	Low- and medium-density advanced ARM??based 32-bit MCU

PDF	104 Pages

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nhà sản xuất	STMICROELECTRONICS [STMicroelectronics]

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99 / 104 page

Package characteristics

STM32F051x

100/105

Doc ID 022265 Rev 3

Figure 38.

UFQFPN32 recommended footprint

Drawing is not to scale.

Dimensions are expressed in millimeters.

7.2

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 20: General operating conditions.

The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated

using the following equation:

TJ max = TA max + (PD max x ΘJA)

Where:

●

TA max is the maximum ambient temperature in °C,

●

ΘJA is the package junction-to-ambient thermal resistance, in °C/W,

●

PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),

●

PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

PI/O max represents the maximum power dissipation on output pins where:

PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),

taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the

application.

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