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AS3668 bảng dữ liệu(PDF) 6 Page - ams AG |
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AS3668 bảng dữ liệu(HTML) 6 Page - ams AG |
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6 / 60 page ![]() www.austriamicrosystems.com/AS3668 Revision 1.11 6 - 60 AS3668 Data Sheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter Min Max Units Comments VBAT, VCP, CN, CP to GND -0.3 7 V VCP to GND -0.3 7 V Protection diode between VCP and GND LED1, LED2, CURR3, CURR4 to GND -0.3 7 V SCL, SDA, GPIO/AUDIO_IN to GND -0.3 7 V Input Pin Current without causing latch up -100 +100 mA At 25ºC, Norm: EIA/JESD78 Electrostatic Discharge ESD HBM (CURR1 to CURR4) 2 kV JEDEC JESD22-A114 ESD HBM (all other pins) 2 kV ESD MM 100 V JEDEC JESD22-A115 ESD CDM 500 V JEDEC JESD22-C101 Storage Temperature Range -55 +125 ºC Temperature Ranges and Storage Conditions Continuous Power Dissipation 0.83 W Internally limited (over temperature protection) 1 1. Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 140°C (typ.) and disengages at TJ = 135°C (typ.). Storage Temperature Range -55 +125 ºC Junction to Ambient Thermal Resistance ( θ JA) 2 2. Junction to ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. 60 °C/W Humidity non-condensing 5 85 % Moisture Sensitive Level 1 Represents a max. floor life time of unlimited. Package Body Temperature +260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/ JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. |
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