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SM320DM6446 bảng dữ liệu(PDF) 6 Page - Texas Instruments |
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SM320DM6446 bảng dữ liệu(HTML) 6 Page - Texas Instruments |
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6 / 228 page ![]() Contents 2 Device Overview 2.1 Device Characteristics SM320DM6446 Digital Media System-on-Chip SPRS607A – JUNE 2009 – REVISED JUNE 2009 www.ti.com 1 Digital Media System-on-Chip (DMSoC) ............ 1 6.1 Parameter Information .............................. 86 6.2 Recommended Clock and Control Signal Transition 1.1 Features .............................................. 1 Behavior ............................................. 87 1.2 SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS ........................... 2 6.3 Power Supplies ...................................... 87 1.3 Description ............................................ 3 6.4 Reset ................................................ 97 1.4 Functional Block Diagram ............................ 5 6.5 External Clock Input From MXI/CLKIN Pin ........ 100 2 Device Overview ......................................... 6 6.6 Clock PLLs ......................................... 102 2.1 Device Characteristics ................................ 6 6.7 Interrupts ........................................... 110 2.2 Device Compatibility .................................. 8 6.8 General-Purpose Input/Output (GPIO) ............. 117 6.9 Enhanced Direct Memory Access (EDMA) 2.3 ARM Subsystem ...................................... 8 Controller ........................................... 120 2.4 DSP Subsystem ..................................... 12 6.10 External Memory Interface (EMIF) ................. 132 2.5 Memory Map Summary ............................. 16 6.11 ATA/CF ............................................ 140 2.6 Pin Assignments .................................... 19 6.12 MMC/SD/SDIO ..................................... 153 2.7 Terminal Functions .................................. 24 6.13 Video Processing Sub-System (VPSS) Overview . 156 2.8 Device Support ...................................... 56 6.14 Host-Port Interface (HPI) ........................... 179 3 Device Configurations ................................. 59 6.15 USB 2.0 ............................................ 182 3.1 System Module Registers ........................... 59 6.16 Universal Asynchronous Receiver/Transmitter 3.2 Power Considerations ............................... 59 (UART) ............................................. 191 3.3 Bootmode ........................................... 60 6.17 Serial Peripheral Interface (SPI) ................... 194 3.4 Configurations at Reset ............................. 64 6.18 Inter-Integrated Circuit (I2C) ....................... 198 3.5 Configurations After Reset .......................... 68 6.19 Audio Serial Port (ASP) ............................ 202 3.6 Emulation Control ................................... 79 6.20 Ethernet Media Access Controller (EMAC) ........ 206 4 System Interconnect ................................... 81 6.21 Management Data Input/Output (MDIO) ........... 213 4.1 System Interconnect Block Diagram ................ 82 6.22 Timer ............................................... 215 5 Device Operating Conditions ........................ 83 6.23 Pulse Width Modulator (PWM) ..................... 217 5.1 Absolute Maximum Ratings Over Operating Case 6.24 VLYNQ ............................................. 219 Temperature Range (Unless Otherwise Noted) ................................. 83 6.25 IEEE 1149.1 JTAG ................................ 223 5.2 Recommended Operating Conditions ............... 84 7 Mechanical Packaging and Orderable Information ............................................. 225 5.3 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Case 7.1 Thermal Data for ZWT ............................. 225 Temperature (Unless Otherwise Noted) ............ 85 7.1.1 Packaging Information ............................. 225 6 Peripheral and Electrical Specifications ........... 86 Table 2-1 provides an overview of the TMS320DM6446 SoC. The table shows significant features of the device, including the capacity of on-chip RAM, peripherals, internal peripheral bus frequency relative to the C64x+ DSP, and the package type with pin count. Contents 6 Submit Documentation Feedback |
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