www.ti.com

DAC5675-EP

SGLS381A – OCTOBER 2006 – REVISED OCTOBER 2006

The DAC5675 has been specifically designed for a differential transformer-coupled output with a 50-

Ω

doubly-terminated load. With the 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an

output power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm) is supported. The last configuration is

preferred for optimum performance at high output frequencies and update rates. The outputs are terminated to

An accurate on-chip 1.2-V temperature-compensated bandgap reference and control amplifier allows the user to

adjust this output current from 20 mA down to 2 mA. This provides 20-dB gain range control capabilities.

Alternatively, an external reference voltage may be applied. The DAC5675 features a SLEEP mode, which

reduces the standby power to approximately 18 mW.

The DAC5675 is available in a 48-pin PowerPAD™ thermally-enhanced thin quad flat pack (HTQFP). This

package increases thermal efficiency in a standard size IC package. The device is specified for operation over

the military temperature range of –55

°C to 125°C.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

PACKAGE

PACKAGE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

LEAD

DESIGNATOR

MARKING

NUMBER

MEDIA, QUANTITY

DAC5675MPHPREP

Tape and reel, 1000

DAC5675-EP

48 HTQFP

PHP

DAC5675-EP

DAC5675MPHPEP

Tray, 250

(1)

For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.

TQFP-48 PACKAGE THERMAL CHARACTERISTICS

SAME PACKAGE

PowerPAD

PARAMETER

FORM WITHOUT

CONNECTED TO

PowerPAD

108.71

°C/W

29.11

°C/W

18.18

°C/W

1.14

°C/W

(1)

Airflow is at 0 LFM (no airflow).

(2)

Specified with the PowerPAD bond pad on the backside of the package soldered to a 2-oz CU plate PCB thermal plane

2

Submit Documentation Feedback