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MIC2169BMM bảng dữ liệu(PDF) 13 Page - Micrel Semiconductor

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nhà sản xuất  MICREL [Micrel Semiconductor]
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MIC2169BMM bảng dữ liệu(HTML) 13 Page - Micrel Semiconductor

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March 2009
13
M9999-032409
MIC2169
Micrel
Design Example
Layout and Checklist:
1. Connect the current limiting (R2) resistor directly
to the drain of top MOSFET Q3.
2. Use a 5
Ω resistor from the input supply to the VIN
pin on the MIC2169. Also, place a 1
μF ceramic
capacitor from this pin to GND, preferably not thru
a via.
3. The feedback resistors R3 and R4/R5/R6 should
be placed close to the FB pin. The top side of R3
should connect directly to the output node. Run
this trace away from the switch node (junction of
Q3, Q2, and L1). The bottom side of R3 should
connect to the GND pin on the MIC2169.
4. The compensation resistor and capacitors should
be placed right next to the COMP pin and the other
side should connect directly to the GND pin on the
MIC2169 rather than going to the plane.
5. Add a 1.4
Ω resistor and a 1000pF capacitor from
the switch node to ground pin. See page 7, Current
Limiting section for more detail.
6. Add place holders for gate resistors on the top and
bottom MOSFET gate drives. If necessary, gate
resistors of 10
Ω or less should be used.
7. Low gate charge MOSFETs should be used to
maximize efficiency, such as Si4800, Si4804BDY,
IRF7821, IRF8910, FDS6680A and FDS6912A,
etc.
8. Compensation component GND, feedback resistor
ground, chip ground should all run together and
connect to the output capacitor ground. See demo
board layout, top layer.
9. The 10
μF ceramic capacitor should be placed
between the drain of the top MOSFET and the
source of the bottom MOSFET.
10.The 10
μF ceramic capacitor should be placed right
on the VDD pin without any vias.
11. The source of the bottom MOSFET should connect
directly to the input capacitor GND with a thick
trace. The output capacitor and the input capacitor
should connect directly to the GND plane.
12.Place a 0.01
μF to 0.1μF ceramic capacitor in parallel
with the CS resistor to filter any switching noise.
+
C6
330uF/6.3V
+
C7
330uF
+
C2
68uF/20V
4
Q2
IRF7821
4
Q3
IRF7821
C5
0.1uF/25V
C12
0.1uF/25V
C9
Open
COMP/EN
4
BST
10
FB
5
LSD
7
HSD
9
VSW
8
U1
MIC2169
JP2
HEADER 3X2
R2
470 ohm
+VIN
C11
Open
C4
10uF/6V
D1
SD103BWS
C13
1uF/16V
R9
10
D2
C15
100pF
C16
0.1uF
1.5V
2.5V
3.3V
Cout=AVX TPSD337M006R0045
Cin=AVX TPSD686M020R0070
C10
0.1uF
+
C3
68uF
1.0uH
R3
10K
R5
4.64K
R6
11.3K
R8
4.02K
R7
100K
R10
4R02 Ohm
R12
47
R4
3.16k
1
J2
SHDN
+
C8
Open
R14
Open
2
1
L1
CDRH127 / LD-1R0-MC
CBA
20V
C1
10uF/16V
C14
DIN
1
Q1
2N7002E
R1
0 Ohm
R11
RES
R13
RES
1
J1
+Vin 5-12V
1
J3
GND
1
J5
GND
1
J4
Vout
MIC2169BMM Evaluation Board Schematic



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