Specified values only apply to CTVS components that have not been subject to prior electrical,

mechanical or thermal damage. The use of CTVS devices in line-to-ground applications is

therefore not advisable, and it is only allowed together with safety countermeasures like

thermal fuses.

Storage

Only store CTVS in their original packaging. Do not open the package before storage.

Storage conditions in original packaging: temperature

25 to +45

°C, relative humidity ≤75%

annual average, maximum 95%, dew precipitation is inadmissible.

Do not store CTVS devices where they are exposed to heat or direct sunlight. Otherwise the

packaging material may be deformed or CTVS may stick together, causing problems during

mounting.

Avoid contamination of the CTVS surface during storage, handling and processing.

Avoid storing CTVS devices in harmful environments where they are exposed to corrosive

Use CTVS as soon as possible after opening factory seals such as polyvinyl-sealed packages.

Solder CTVS components after shipment from EPCOS within the time specified:

CTVS with Ni barrier termination, 12 months

CTVS with AgPd and AgPt termination, 6 months

SHCV and CU series, 24 months

Handling

Do not drop CTVS components and allow them to be chipped.

Do not touch CTVS with your bare hands - gloves are recommended.

Avoid contamination of the CTVS surface during handling.

Mounting

When CTVS devices are encapsulated with sealing material or overmolded with plastic

material, electrical characteristics might be degraded and the life time reduced.

Make sure an electrode is not scratched before, during or after the mounting process.

Make sure contacts and housings used for assembly with CTVS components are clean before

mounting.

The surface temperature of an operating CTVS can be higher. Ensure that adjacent

components are placed at a sufficient distance from a CTVS to allow proper cooling.

Avoid contamination of the CTVS surface during processing.

Multilayer varistors (MLVs) with AgPd termination are not approved for lead-free soldering.

Soldering

Complete removal of flux is recommended to avoid surface contamination that can result in an

instable and/or high leakage current.

Use resin-type or non-activated flux.

Bear in mind that insufficient preheating may cause ceramic cracks.

Rapid cooling by dipping in solvent is not recommended, otherwise a component may crack.

SMD disk varistors (CU varistors)

Automotive series

Page 28 of 30

Please read Cautions and warnings and

Important notes at the end of this document.