Good and poor solder joints caused by amount of solder in reflow soldering.

5

Conductive adhesion

Attaching surface-mounted devices (SMDs) with electrically conductive adhesives is a commer-

cially attractive method of component connection to supplement or even replace conventional sol-

dering methods.

Electrically conductive adhesives consist of a non-conductive plastic (epoxy resin, polyimide or

silicon) in which electrically conductive metal particles (gold, silver, palladium, nickel, etc) are em-

bedded. Electrical conduction is effected by contact between the metal particles.

Adhesion is particularly suitable for meeting the demands of hybrid technology. The adhesives

can be deposited ready for production requirements by screen printing, stamping or by dis-

pensers. As shown in the following table, conductive adhesion involves two work operations fewer

than soldering.

Reflow soldering

Wave soldering

Conductive adhesion

Screen-print solder paste

Apply glue dot

Screen-print conductive adhesive

Mount SMD

Mount SMD

Mount SMD

Predry solder paste

Cure glue

Cure adhesive

Reflow soldering

Wave soldering

Inspect

Wash

Wash

Inspect

Inspect

SMD disk varistors (CU varistors)

Automotive series

Page 20 of 30

Please read Cautions and warnings and

Important notes at the end of this document.