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MPC5673K bảng dữ liệu(PDF) 110 Page - Freescale Semiconductor, Inc |
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MPC5673K bảng dữ liệu(HTML) 110 Page - Freescale Semiconductor, Inc |
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110 / 140 page ![]() MPC5675K Microcontroller Data Sheet, Rev. 4 Preliminary—Subject to Change Without Notice Electrical characteristics Freescale Semiconductor 110 3.22 Peripheral timing characteristics 3.22.1 SDRAM (DDR) The MPC5675K memory controller supports three types of DDR devices: • DDR-1 (SSTL_2 class II interface) • DDR-2 (SSTL_18 interface) • LPDDR/Mobile-DDR (1.8V I/O supply voltage) JEDEC standards define the minimum set of requirements for compliant memory devices: • JEDEC STANDARD, DDR2 SDRAM SPECIFICATION, JESD79-2C, MAY 2006 • JEDEC STANDARD, Double Data Rate (DDR) SDRAM Specification, JESD79E, May 2005 • JEDEC STANDARD, Low Power Double Data Rate (LPDDR) SDRAM Specification, JESD79-4, May 2006 The MPC5675K supports the configuration of two output drive strengths for DDR2 and LPDDR: • Full drive strength • Half drive strength (intended for lighter loads or point-to-point environments) The MPC5675K memory controller supports dynamic on-die termination in the host device and in the DDR2 memory device. This section includes AC specifications for all DDR SDRAM pins. The DC parameters are specified in the Section 3.19, DRAM pad specifications. 3.22.1.1 DDR and DDR2 SDRAM AC timing specifications Table 61. DDR and DDR2 (DDR2-400) SDRAM timing specifications At recommended operating conditions with VDD_MEM_IO of 5% No. Symbol Parameter Min Max Unit 1 tCK CC Clock cycle time, CL = x —90 MHz 2 VIX-AC CC MCK AC differential crosspoint voltage1 VDD_MEM_IO ×0.5 –0.1 VDD_MEM_IO ×0.5 +0.1 V 3 tCH CC CK HIGH pulse width1, 2 0.47 0.53 tCK 4 tCL CC CK LOW pulse width1, 2 0.47 0.53 tCK 5 tDQSS CC Skew between MCK and DQS transitions2, 3 0.25 0.25 tCK 8 tOS(base) CC Address and control output setup time relative to MCK rising edge2, 3 (tCK/2 – 750) ps 9 tOH(base) CC Address and control output hold time relative to MCK rising edge2, 3 (tCK/2 – 750) — ps 11 tDS1(base) CC DQ and DM output setup time relative to DQS2, 3 (tCK/4 – 500) — ps 12 tDH1(base) CC DQ and DM output hold time relative to DQS2, 3 (tCK/4 – 500) — ps |
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