Analog Integrated Circuit Device Data

6

Freescale Semiconductor

33882

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

THERMAL RESISTANCE (12), (13)

Junction-to-Ambient, Natural Convection, Single-Layer Board (1s) (14)

HSOP

QFN

SOIC

41

85

72

°C/W

Junction-to-Ambient, Natural Convection, Four-Layer Board (2s2p) (15)

HSOP

QFN

SOIC(17)

18

27

TBD

°C/W

Junction-to-Board (Bottom)

HSOP

QFN

SOIC(17)

3.0

10

TBD

°C/W

Junction-to-Case (Top) (16)

HSOP

QFN

SOIC

0.2

1.2

1.0

°C/W

Notes

12.

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient

temperature, air flow, power dissipation of other components on the board, and board thermal resistance.

13.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top

surface of the board near the package.

14.

Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

15.

Per JEDEC JESD51-6 with the board horizontal.

16.

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC

883, Method 1012.1) with the cold plate temperature used for the case temperature.

17.

This value will be included when available.

Table 2. Maximum Ratings (continued)

All voltages are with respect to ground unless otherwise noted.

Rating

Symbol

Value

Limit