MFSYS25 datasheet(21/52 Pages) INTEL

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Intel® Modular Server System MFSYS25/MFSYS35 TPS

System Details

Table 4. Physical Dimensions of Hardware Components

Module

Height

Width

Length

Chassis

261.4 mm

444.4 mm

720.2 mm

Compute module

41.7 mm

279.4 mm

420.3 mm

CMM

25.0 mm

167.6 mm

295.9 mm

I/O

38.0 mm

167.6 mm

295.9 mm

Storage

32.0 mm

167.6 mm

295.9 mm

Hard drive bay

182.5 mm

130.2 mm

419.1 mm

Power supply

module

53.3 mm

115 mm

286.3 mm

Main cooling module

126.6 mm

126.0 mm

291.9 mm

I/O cooling module

49.4 mm

132.6 mm

416.9 mm

3.1.3

Power Specifications Summary

The following table provides a summary of the 12V power budget for all modules in the Intel

Modular Server System MFSYS25/MFSYS35

Table 5. Power Budget of Hardware Components

Subsystem

12V

Budget

Compute module

406 W

Mezzanine card

5 W

Chassis management module

5 W

I/O Switch

40 W

Storage module

48 W

2.5/3.5-inch SAS drives

140 W

Chassis

188 W

Power supply blank

26 W

System Total

Power subsystem spec

3000 W

The following table provides a summary of the power and heat dissipation specifications for the

Intel

® Modular Server System MFSYS25/MFSYS35.

Table 6. Power and Heat Dissipation Specifications of Chassis

Power Supply Input

1240 W

Power Supply Output

1050 W

System Power Input

3720 W

System Power Output

3150 W

System Power

100 V – 127 V, 200 V – 240 V

System Heat Dissipation

3720 W (12,701 BTUH) maximum

System Heat Dissipation

428 W (1461 BTUH) minimum

Revision 1.3

Intel order number E15155-005

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