MFSYS25 datasheet(2/52 Pages) INTEL

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Revision History

Intel® Modular Server System MFSYS25/MFSYS35 TPS

Revision History

Date

Revision

Number

Modifications

July, 2007

0.88

Initial release.

September, 2007

1.0

Updated.

February, 2008

1.1

Updated.

June, 2008

1.2

Updated Power Budget of Hardware Components, Table 5. Added 3.5-inch drive

bay information for the Intel® Modular Server System MFSYS35.

November, 2008

1.3

Updated System Details, power and heat specifications

Disclaimers

Information in this document is provided in connection with Intel

® products. No license, express or

implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except

as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability

whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel

products including liability or warranties relating to fitness for a particular purpose, merchantability, or

infringement of any patent, copyright or other intellectual property right. Intel products are not intended for

use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and

product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked

“reserved” inches or “undefined” Intel reserves these for future definition and shall have no responsibility

whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel

® Modular Server System MFSYS25/MFSYS35 may contain design defects or errors known as

errata, which may cause the product to deviate from published specifications. Current characterized

errata are available on request.

Intel Corporation server baseboards contain a number of high-density VLSI and power delivery

components that need adequate airflow to cool. Intel’s own chassis are designed and tested to meet the

intended thermal requirements of these components when the fully integrated system is used together. It

is the responsibility of the system integrator that chooses not to use Intel developed server building

blocks to consult vendor datasheets and operating parameters to determine the amount of airflow

required for their specific application and environmental conditions. Intel Corporation cannot be held

responsible if components fail or the server board does not operate correctly when used outside any of

their published operating or non-operating limits.

Intel and Xeon are trademarks or registered trademarks of Intel Corporation.

2008

Revision 1.3

Intel order number E15155-005

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