352 datasheet(33/95 Pages) INTEL

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Datasheet

Package Mechanical Specifications

Package Mechanical

Specifications

The Celeron D processor is packaged in a Flip-Chip Land Grid Array (FC-LGA4) package

that interfaces with the motherboard via an LGA775 socket. The package consists of a

processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)

is attached to the package substrate and core and serves as the mating surface for

processor component thermal solutions, such as a heatsink. Figure 4 shows a sketch of

the processor package components and how they are assembled together. Refer to the

LGA775 Socket Mechanical Design Guide for complete details on the LGA775 socket.

The package components shown in Figure 4 include the following:

• Integrated Heat Spreader (IHS)

• Thermal Interface Material (TIM)

• Processor core (die)

• Package substrate

• Capacitors

NOTE:

Socket and motherboard are included for reference and are not part of processor package.

3.1

Package Mechanical Drawing

The package mechanical drawings are shown in Figure 5 and Figure 6. The drawings

include dimensions necessary to design a thermal solution for the processor. These

dimensions include:

• Package reference with tolerances (total height, length, width, etc.)

• IHS parallelism and tilt

• Land dimensions

• Top-side and back-side component keep-out dimensions

• Reference datums

• All drawing dimensions are in mm [in].

• Guidelines on potential IHS flatness variation with socket load plate actuation and

installation of the cooling solution is available in the processor Thermal and

Mechanical Design Guidelines.

Figure 4.

Processor Package Assembly Sketch

System Board

LGA775 Socket

Capacitors

TIM

Core (die)

IHS

Substrate

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