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641 bảng dữ liệu(PDF) 98 Page - Intel Corporation

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Giải thích chi tiết về linh kiện  Intel Pentium 4 Processor
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nhà sản xuất  INTEL [Intel Corporation]
Trang chủ  http://www.intel.com
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641 bảng dữ liệu(HTML) 98 Page - Intel Corporation

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Balanced Technology Extended (BTX) Boxed Processor Specifications
98
Datasheet
NOTE: Diagram does not show the attached hardware for the clip design and is provided only as a
mechanical representation.
8.1.2
Boxed Processor Thermal Module Assembly Weight
The boxed processor thermal module assembly for Type I BTX will not weigh more than
1200 grams. The boxed processor thermal module assembly for Type II BTX will not
weigh more than 1200 grams. See Chapter 5 and the appropriate processor Thermal
and Mechanical Design Guidelines (see Section 1.2) for details on the processor weight
and thermal module assembly requirements.
8.1.3
Boxed Processor Support and Retention Module (SRM)
The boxed processor TMA requires an SRM assembly provided by the chassis
manufacturer. The SRM provides the attach points for the TMA and provides structural
support for the board by distributing the shock and vibration loads to the chassis base
pan. The boxed processor TMA will ship with the heatsink attach clip assembly, duct
and screws for attachment. The SRM must be supplied by the chassis hardware vendor.
See the Support and Retention Module (SRM) External Design Requirements
Figure 28.
Requirements for the Balanced Technology Extended (BTX) Type II Keep-out
Volume



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