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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Thermal Specifications

Notes:

Thermal Profile is representative of a volumetrically constrained platform. Please refer to Table 6-8 for

discrete points that constitute the thermal profile.

Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of

thermal solutions that do not meet Thermal Profile will not meet the processor’s thermal specifications and

may result in permanent damage to the processor.

Refer to the Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines for

system and environment implementation details.

6.1.2

Thermal Metrology

The minimum and maximum case temperatures (TCASE) specified in Table 6-2,

Table 6-3, Table 6-5, and Table 6-6 are measured at the geometric top center of the

processor integrated heat spreader (IHS). Figure 6-4 illustrates the location where

Figure 6-3. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile

Thermal Profile

2030

5060

100

Pow e r [W]

Thermal Profile

Y = 0.260*x + 42.3

TCASE_MAX@TDP

Thermal Profile

2030

5060

100

Pow e r [W]

Thermal Profile

Y = 0.260*x + 42.3

TCASE_MAX@TDP

Table 6-8.

Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table

Power (W)

TCASE_MAX (° C)

Power (W)

TCASE_MAX (° C)

P_profile_min_B=29.6

50.0

61.8

51.4

63.1

52.7

64.4

54.0

65.7

55.3

67.0

56.6

57.9

59.2

60.5

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