© Koninklijke Philips Electronics N.V. 2003.

Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner.

The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No

liability will be accepted by the publisher for any consequence of its use. Publication

thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 24 November 2003

Document order number: 9397 750 11943

Contents

Philips Semiconductors

PIP202-12M-2

DC-to-DC converter powertrain

1

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4

Ordering information . . . . . . . . . . . . . . . . . . . . . 1

5

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6

Pinning information . . . . . . . . . . . . . . . . . . . . . . 2

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7

Functional description . . . . . . . . . . . . . . . . . . . 3

7.1

Basic functionality . . . . . . . . . . . . . . . . . . . . . . . 3

7.2

MOSFET driver function . . . . . . . . . . . . . . . . . . 4

7.3

Bootstrap diode. . . . . . . . . . . . . . . . . . . . . . . . . 4

7.4

3-state function . . . . . . . . . . . . . . . . . . . . . . . . . 5

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

9

Thermal characteristics. . . . . . . . . . . . . . . . . . . 6

10

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6

11

Application information. . . . . . . . . . . . . . . . . . . 9

11.1

Typical application. . . . . . . . . . . . . . . . . . . . . . . 9

11.2

Advantages of an integrated driver . . . . . . . . . 10

11.3

External connection of power and signal lines 10

11.4

Switching frequency . . . . . . . . . . . . . . . . . . . . 11

11.5

Thermal design . . . . . . . . . . . . . . . . . . . . . . . . 11

12

Test information . . . . . . . . . . . . . . . . . . . . . . . . 13

13

Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

14

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14

15

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.1

Introduction to soldering MLF packages. . . . . 15

15.2

Rework guidelines . . . . . . . . . . . . . . . . . . . . . 16

16

Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16.1

PCB design guidelines . . . . . . . . . . . . . . . . . . 16

16.2

Solder paste printing. . . . . . . . . . . . . . . . . . . . 17

17

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18

18

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19

19

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

20

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19