Philips Semiconductors

PIP202-12M-2

DC-to-DC converter powertrain

Product data

Rev. 02 — 24 November 2003

17 of 20

9397 750 11943

© Koninklijke Philips Electronics N.V. 2003. All rights reserved.

16.2 Solder paste printing

The process of printing the solder paste requires care because of the fine pitch and

small size of the solder lands. A stencil thickness of 0.125 mm is recommended. The

stencil apertures can be made the same size as the PCB lands in Figure 20.

The type of solder paste recommended for MLF packages is “No clean”, Type 3, due

to the difficulty of cleaning flux residues from beneath the MLF package.

All dimensions in mm.

Fig 20. PCB footprint for SOT687-1 package (reflow soldering).

0.4 SP (2

×)

11.15 OA

(2

×)

7.6 Cu

(2

×)

10.8 Cu

(2

×)

0.9 SP

(10

×)

0.5 SP

(4

×)

1 SP

(10

×)

8.9 Cu

(2

×)

1 SP

(8

×)

1 SP

(8

×)

0.28 Cu (68

×)

0.4 SP

0.4 SP

0.6 Cu

4.1

8.63 OA

(4

×)

4.1

0.6 Cu

e = 0.5

MGW820

solder lands

Cu pattern

clearance

solder paste

occupied area

0.1

0.2

0.025