ADM1029ARQZ-R7 datasheet(3/50 Pages) ONSEMI

3 / 50 page

Rev. 1 | Page 3 of 50 | www.onsemi.com

Parameter

Min

Typ

Max

Unit

Test Conditions/Comments

SERIAL BUS TIMING

5 (continued)

SCL Low Time, tLOW

1.3

µs

See Figure 1

SCL High Time, tHIGH

µs

See Figure 1

SCL, SDA Rise Time, tR

1000

See Figure 1

SCL, SDA Fall Time, tF

300

See Figure 1

Data Setup Time, tSU:DAT

250

See Figure 1

Data Hold Time, tHD:DAT

300

See Figure 1

NOTES

1All voltages are measured with respect to GND, unless otherwise speciﬁed.

2Typicals are at T

A = 25°C and represent most likely parametric norm. Shutdown current typ is measured with V CC = 3.3 V.

3TUE (Total Unadjusted Error) includes Offset, Gain, and Linearity errors of the ADC, multiplexer.

4The total fan count is based on two pulses per revolution of the fan tachometer output.

5Timing speciﬁcations are tested at logic levels of V

IL = 0.8 V for a falling edge and VIH = 2.1 V for a rising edge.

Speciﬁcations subject to change without notice.

ABSOLUTE MAXIMUM RATINGS

Positive Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . 6.5 V

Voltage on Pins 13–18 . . . . . . . . . . . . –0.3 V to (VCC + 0.3 V)

Voltage on Any Other Input or Output Pin . . . . –0.3 V to +6.5 V

Input Current at Any Pin . . . . . . . . . . . . . . . . . . . . . . . ± 5 mA

Package Input Current . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA

Maximum Junction Temperature (TJ max) . . . . . . . . . . 150°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Lead Temperature

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200°C

ESD Rating All Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

PIN CONFIGURATION

ADM1029

TOP VIEW

(Not To Scale)

DRIVE1

FAULT1

TACH1

PRESENT1

SCL

SDA

GND

VCC

CFAULT

INT

GPIO2

RESET

DRIVE2

FAULT2

TACH2

PRESENT2

AIN1/GPIO1

AIN0/GPIO0

TMIN/INSTALL

D2+/GPIO6

D2–/GPIO5

ADD

D1+/GPIO4

D2–/GPIO3

THERMAL CHARACTERISTICS

24-Lead QSOP Package:

θJA = 105°C/W, θJC = 39°C/W

tHD;STA

tHD;DAT

tHIGH

tSU;DAT

tSU;STA

tSU;STO

tLOW

tHD;STA

SCL

SDA

tBUF

Figure 1. Diagram for Serial Bus Timing

ADM1029

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