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SE98PW bảng dữ liệu(PDF) 34 Page - NXP Semiconductors |
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SE98PW bảng dữ liệu(HTML) 34 Page - NXP Semiconductors |
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34 / 39 page ![]() SE98_4 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 04 — 2 February 2009 34 of 39 NXP Semiconductors SE98 DDR memory module temp sensor, 3.3 V For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations MSL: Moisture Sensitivity Level Fig 22. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 30. Abbreviations Acronym Description ADC Analog-to-Digital Converter ARA Alert Response Address CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DIMM Dual In-line Memory Module DRAM Dynamic Random Access Memory HBM Human Body Model I2C-bus Inter Integrated Circuit bus LSB Least Significant Bit MM Machine Model MSB Most Significant Bit SO-DIMM Small Outline Dual In-line Memory Module POR Power-On Reset SMBus System Management Bus SPD Serial Presence Detect |
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