SE98PW datasheet(2/39 Pages) NXP

2 / 39 page

SE98_4

Product data sheet

Rev. 04 — 2 February 2009

2 of 39

NXP Semiconductors

SE98

DDR memory module temp sensor, 3.3 V

Features

2.1 General features

I JEDEC (JC-42.4) SO-DIMM temperature sensor

I Optimized for voltage range: 3.0 V to 3.6 V

I Shutdown/Standby current: 8 µA (typ.) and 15 µA (max.)

I 2-wire interface: I2C-bus/SMBus compatible, 0 Hz to 400 kHz

I SMBus ALERT and TIMEOUT (programmable)

I Available packages: TSSOP8 and HVSON8

2.2 Temperature sensor features

I Temperature-to-Digital converter

I Operating current: 200 µA (typ.) and 250 µA (max.)

I Programmable hysteresis threshold: 0 °C, 1.5 °C, 3 °C, 6 °C

I Over/under/critical temperature EVENT output

I C grade accuracy:

N ±1 °C/±2 °C (typ./max.) → +75 °C to +95 °C

N ±2 °C/±3 °C (typ./max.) → +40 °C to +125 °C

N ±3 °C/±4 °C (typ./max.) →−40 °C to +125 °C

Applications

I DDR2 and DDR3 memory modules

I Laptops, personal computers and servers

I Enterprise networking

I Hard disk drives and other PC peripherals

Ordering information

Table 1.

Ordering information

Type number

Topside

mark

Package

Name

Description

Version

SE98PW

SE98

TSSOP8

plastic thin shrink small outline package; 8 leads;

body width 4.4 mm

SOT530-1

SE98TK

SE98

HVSON8

plastic thermal enhanced very thin small outline package;

no leads; 8 terminals; body 3

× 3 × 0.85 mm

SOT908-1

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