PDTC124TS datasheet(5/14 Pages) NXP

5 / 14 page

2004 Aug 13

NXP Semiconductors

Product data sheet

NPN resistor-equipped transistors;

R1 = 22 k

Ω, R2 = open

PDTC124T series

THERMAL CHARACTERISTICS

Notes

Refer to standard mounting conditions.

Reflow soldering is the only recommended soldering method.

Refer to SOT883 standard mounting conditions; FR4 with 60

μm copper strip line.

CHARACTERISTICS

Tamb = 25 °C unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

Rth(j-a)

thermal resistance from junction to ambient

in free air

SOT54

note 1

250

K/W

SOT23

note 1

500

K/W

SOT346

note 1

500

K/W

SOT323

note 1

625

K/W

SOT490

notes 1 and 2

500

K/W

SOT883

notes 2 and 3

500

K/W

SOT416

note 1

833

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

ICBO

collector-base cut-off current

VCB = 50 V; IE = 0 A

−

100

ICEO

collector-emitter cut-off current

VCE = 30 V; IB = 0 A

−

μA

VCE = 30 V; IB = 0 A; Tj = 150 °C

−

μA

IEBO

emitter-base cut-off current

VEB = 5 V; IC = 0 A

−

100

hFE

DC current gain

VCE = 5 V; IC = 1 mA

100

−

VCEsat

collector-emitter saturation voltage

IC = 10 mA; IB = 0.5 mA

−

150

input resistor

15.4

28.6

collector capacitance

IE = ie = 0 A; VCB = 10 V;

f = 1 MHz

−

2.5

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