BCM856BS_BCM856DS_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 7 August 2008

9 of 14

NXP Semiconductors

BCM856BS; BCM856DS

PNP/PNP matched double transistors

11. Packing information

[1]

For further information and the availability of packing methods, see Section 15.

[2]

T1: normal taping

[3]

T2: reverse taping

12. Soldering

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

10000

BCM856BS

SOT363

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-165

BCM856BS/DG SOT363

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-165

BCM856DS

SOT457

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-165

BCM856DS/DG SOT457

4 mm pitch, 8 mm tape and reel; T1

[2] -115

-135

4 mm pitch, 8 mm tape and reel; T2

[3] -125

-165

Fig 13. Reflow soldering footprint SOT363 (SC-88)

solder lands

solder resist

occupied area

solder paste

sot363_fr

2.65

2.35

0.4 (2

×)

0.6

(2

×)

0.5

(4

×)

0.5

(4

×)

0.6

(4

×)

0.6

(4

×)

1.5

1.8

Dimensions in mm