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STM32F100C4 bảng dữ liệu(PDF) 35 Page - STMicroelectronics

tên linh kiện STM32F100C4
Giải thích chi tiết về linh kiện  Low & medium-density value line, advanced ARM-based 32-bit MCU Low & medium-density value line, advanced ARM-based 32-bit MCU
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nhà sản xuất  STMICROELECTRONICS [STMicroelectronics]
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STM32F100C4 bảng dữ liệu(HTML) 35 Page - STMicroelectronics

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STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
Electrical characteristics
Doc ID 16455 Rev 2
35/84
5.3.2
Operating conditions at power-up / power-down
Subject to general operating conditions for TA.
Table 9.
Operating conditions at power-up / power-down
5.3.3
Embedded reset and power control block characteristics
The parameters given in Table 10 are derived from tests performed under the ambient
temperature and VDD supply voltage conditions summarized in Table 8.
VBAT
Backup operating voltage
1.8
3.6
V
P
D
Power dissipation at TA =
85 °C for suffix 6 or TA =
105 °C for suffix 7(2)
LQFP100
434
mW
LQFP64
444
TFBGA64
308
LQFP48
363
TA
Ambient temperature for 6
suffix version
Maximum power dissipation
–40
85
°C
Low power dissipation(3)
–40
105
Ambient temperature for 7
suffix version
Maximum power dissipation
–40
105
°C
Low power dissipation(3)
–40
125
TJ
Junction temperature range
6 suffix version
–40
105
°C
7 suffix version
–40
125
1.
When the ADC is used, refer to Table 41: ADC characteristics.
2.
If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax (see Table 6.2: Thermal
characteristics on page 79).
3.
In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see
Table 6.2: Thermal characteristics on page 79).
Table 8.
General operating conditions (continued)
Symbol
Parameter
Conditions
Min
Max
Unit
Symbol
Parameter
Min
Max
Unit
tVDD
VDD rise time rate
0
µs/V
VDD fall time rate
20



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