AM1808AZCE4 datasheet(258/264 Pages) TI

258 / 264 page

AM1808

( )

ZKB

( )

PREFIX

X = Experimental Device

P = Prototype Device

Blank = Production Device

DEVICE

SILICON REVISION

3 = 300 MHz (for revision A)

3 = 375 MHz (for revision B)

Blank

PACKAGE TYPE

361 Pin Plastic BGA, with Pb-free

Soldered Balls [Green], 0.65-mm Ball Pitch

ZCE =

DEVICE SPEED RANGE

TEMPERATURE RANGE (JUNCTION)

= Silicon Revision 2.0

= 0°C to 90°C (Commercial Grade)

= -40°C to 90°C (Industrial Grade)

= Silicon Revision 1.1

361 Pin Plastic BGA, with Pb-free

Soldered Balls [Green]; 0.80-mm Ball Pitch

ZWT =

4 = 456 MHz

= -40°C to 105°C( Extended Grade)

AM1808

SPRS653 – FEBRUARY 2010

www.ti.com

Mechanical Packaging and Orderable Information

This section describes the device orderable part numbers, packaging options, materials, thermal and

mechanical parameters.

8.1

Device and Development-Support Tool Nomenclature

Figure 8-1 provides a legend for reading the complete device.

BGA = Ball Grid Array

Figure 8-1. Device Nomenclature

258

Mechanical Packaging and Orderable Information

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