MPC5604P datasheet(30/84 Pages) FREESCALE

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MPC5604P Microcontroller Data Sheet, Rev. 5

Preliminary—Subject to Change Without Notice

Freescale Semiconductor

3.3.1

General notes for specifications at maximum junction temperature

An estimation of the chip junction temperature, TJ, can be obtained from Equation 1:

TJ = TA + (RθJA * PD)

Eqn. 1

where:

TA = ambient temperature for the package (oC)

RθJA= junction to ambient thermal resistance (oC/W)

PD = power dissipation in the package (W)

The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal

performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value

obtained on a board with two planes. For packages such as the PBGA, these values can be different by a factor of two. Which

value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a

single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal

planes is usually appropriate if the board has low power dissipation and the components are well separated.

When a heat sink is used, the thermal resistance is expressed in Equation 2 as the sum of a junction to case thermal resistance

and a case to ambient thermal resistance:

RθJA = RθJC + RθCA

Eqn. 2

Table 9. Thermal characteristics for 100-pin LQFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

No.

Symbol

Parameter

Conditions

Typical

Value

Unit

1RθJA

Thermal resistance junction-to-ambient

natural convection2

2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board—1s

56,3

°C/W

2RθJA

Thermal resistance junction-to-ambient

natural convection2

Four layer board—2s2p

43,4

°C/W

3RθJMA

Thermal resistance junction-to-ambient2

@ 200 ft./min.3, single layer

board—1s

3 Flow rate of forced air flow.

°C/W

4RθJMA

Thermal resistance junction-to-ambient2

@ 200 ft./min.3, four layer

board—2s2p

°C/W

5RθJB

Thermal resistance junction to board4

4 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

—27

°C/W

6RθJCtop Thermal resistance junction to case (Top)

5 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

—14

°C/W

Junction to package top natural convection6

6 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

—3

°C/W

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