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MPC5604P bảng dữ liệu(PDF) 29 Page - Freescale Semiconductor, Inc

tên linh kiện MPC5604P
Giải thích chi tiết về linh kiện  microcontroller units (MCUs)
PDF  84 Pages
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MPC5604P bảng dữ liệu(HTML) 29 Page - Freescale Semiconductor, Inc

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MPC5604P Microcontroller Data Sheet, Rev. 5
Preliminary—Subject to Change Without Notice
Freescale Semiconductor
29
Figure 7. Independent ADC supply
3.3
Thermal characteristics
Table 8. Thermal characteristics for 144-pin LQFP1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
No.
Symbol
Parameter
Conditions
Typical
Value
Unit
1RθJA
Thermal resistance junction-to-ambient,
natural convection2
2 Junction-to-Ambient thermal resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board—1s
52
°C/W
2RθJA
Thermal resistance junction-to-ambient,
natural convection2
Four layer board—2s2p
43
°C/W
3RθJMA
Thermal resistance junction-to-ambient2
@ 200 ft./min.3, single layer
board—1s
3 Flow rate of forced air flow.
43
°C/W
4RθJMA
Thermal resistance junction-to-ambient2
@ 200 ft./min.3, four layer
board—2s2p
37
°C/W
5RθJB
Thermal resistance junction to board4
4 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
—31
°C/W
6RθJCtop Thermal resistance junction to case (top)
5
5 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
—12
°C/W
7
Ψ
JT
Junction to package top natural convection6
6 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
—2
°C/W
5.5V
3.0V
VDD_HV_REG
3.0V
5.5V



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