MCP2021 datasheet(29/46 Pages) MICROCHIP

29 / 46 page

DS22018E-page 29

MCP2021/2

8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN]

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Package is saw singulated.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

0.80 BSC

Overall Height

0.80

0.90

1.00

Standoff

0.00

0.02

0.05

Contact Thickness

0.20 REF

Overall Length

4.00 BSC

Exposed Pad Width

0.00

2.20

2.80

Overall Width

4.00 BSC

Exposed Pad Length

0.00

3.00

3.60

Contact Width

0.25

0.30

0.35

Contact Length

0.30

0.55

0.65

Contact-to-Exposed Pad

0.20

–

NOTE 1

NOTE 2

NOTE 1

EXPOSED

PAD

TOP VIEW

BOTTOM VIEW

Microchip Technology Drawing C04-131C

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