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THS6214IPWPR bảng dữ liệu(PDF) 31 Page - Texas Instruments |
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THS6214IPWPR bảng dữ liệu(HTML) 31 Page - Texas Instruments |
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31 / 41 page ![]() THS6214 www.ti.com ....................................................................................................................................................................................................... SBOS431 – MAY 2009 e) Socketing a high-speed part such as the f) Use the –VS plane to conduct heat out of the THS6214 is not recommended. The additional lead QFN-24 and TSSOP-24 PowerPAD packages. These length and pin-to-pin capacitance introduced by the packages attach the die directly to an exposed socket can create an extremely troublesome parasitic thermal pad on the bottom, which should be soldered network, which can make it almost impossible to to the board. This pad must be connected electrically achieve a smooth, stable frequency response. Best to the same voltage plane as the most negative results are obtained by soldering the THS6214 supply applied to the THS6214 (in Figure 82, this directly onto the board. supply is –12V). Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 31 Product Folder Link(s): THS6214 |
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