PCA2002_5

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 05 — 11 November 2008

16 of 25

NXP Semiconductors

PCA2002

32 kHz watch circuit programmable output period and pulse width

[1]

All coordinates are referenced, in

µm, to the center of the die (see Figure 10 and Figure 11).

[2]

[3]

Pad i.c. is used for factory test; in normal operation it must be left open-circuit, and it has an internal

Fig 11. Bare die outline PCA200xCX (WLCSP8)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

PCA200xCX

WLCSP8: wafer level chip-size package; 8 bumps; 1.16 x 0.86 x 0.31 mm

PCA200xCX

UNIT

mm

max

nom

min

0.310

0.275

0.240

0.090

0.075

0.060

1.16

0.86

0.17

0.32

A

DIMENSIONS (mm are the original dimensions)

0.22

0.20

0.18

D

0.12

0.10

0.08

b

E

0.96

0

0.5

1 mm

scale

X

detail X

A

D

b

E

08-05-09

08-05-21

Table 11.

Bonding pad and solder bump locations

Symbol

Pad

Coordinates[1]

x

y

1

−480

+330

i.c.[3]

2

−480

+160

OSCIN

3

−480

−160

OSCOUT

4

−480

−330

5

+480

−330

MOT1

6

+480

−160

MOT2

7

+480

+160

RESET

8

+480

+330