AT89C51CC03U-RDTIM datasheet(160/183 Pages) ATMEL

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AT89C51CC03

4182B–CAN–09/03

Electrical Characteristics

Absolute Maximum Ratings

DC Parameters for Standard Voltage

TA = -40

°C to +85°C; V

SS = 0V; VCC = 3V to 5.5V; F = 0 to 40 MHz

Ambiant Temperature Under Bias:

I = industrial ....................................................... -40

°C to 85°C

Storage Temperature .................................... -65

°C to + 150°C

Voltage on V

CC from VSS ......................................-0.5V to + 6V

Voltage on Any Pin from V

SS..................... -0.5V to VCC + 0.2V

Power Dissipation .............................................................. 1 W

Table 115. DC Parameters in Standard Voltage

Symbol Parameter

Min

Typ(5)

Max

Unit

Test Conditions

Input Low Voltage

-0.5

0.2Vcc -

0.1

Input High Voltage except XTAL1,

RST

0.2 VCC +

0.9

CC + 0.5

IH1

Input High Voltage, XTAL1, RST

0.7 V

CC + 0.5

Output Low Voltage, ports 1, 2, 3

and 4

(6)

0.3

0.45

1.0

OL = 100 µA

(4)

OL = 1.6 mA

(4)

OL = 3.5 mA

(4)

OL1

Output Low Voltage, port 0, ALE,

PSEN

(6)

0.3

0.45

1.0

OL = 200 µA

(4)

OL = 3.2 mA

(4)

OL = 7.0 mA

(4)

Output High Voltage, ports 1, 2, 3,

and 4

CC - 0.3

CC - 0.7

CC - 1.5

OH = -10 µA

OH = -30 µA

OH = -60 µA

CC = 3V to 5.5V

OH1

Output High Voltage, port 0, ALE,

PSEN

CC - 0.3

CC - 0.7

CC - 1.5

OH = -200 µA

OH = -3.2 mA

OH = -7.0 mA

CC = 5V ± 10%

RST

RST Pulldown Resistor

200

Ω

IIL

Logical 0 Input Current ports 1, 2,

3 and 4

-50

µA Vin = 0.45V

Input Leakage Current

±10

µA 0.45V < Vin < V

Logical 1 to 0 Transition Current,

ports 1, 2, 3 and 4

-650

µAVin = 2.0V

Capacitance of I/O Buffer

Fc = 1 MHz

TA = 25

°C

Power-down Current

TBD

µA3V < V

CC < 5.5V

(3)

Note:

Stresses at or above those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device. This

is a stress rating only and functional operation of the device

at these or any other conditions above those indicated in

the operational sections of this specification is not implied.

Exposure to absolute maximum rating conditions may affect

device reliability.

The power dissipation is based on the maximum allowable

die temperature and the thermal resistance of the package.

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