AD8260ACPZ-R7 datasheet(32/32 Pages) AD

32 / 32 page

AD8260

Rev. 0 | Page 32 of 32

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

2.85

2.70 SQ

2.55

TOP

VIEW

COPLANARITY

0.08

3.50 REF

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.20 MIN

EXPOSED

PAD

(BOT TOM VIEW)

PIN 1

INDICATOR

0.30

0.25

0.18

0.20 REF

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

0.50

0.40

0.30

5.00

BSC SQ

4.75

BSC SQ

THE EXPOSED PAD IS NOT CONNECTED

INTERNALLY. FOR INCREASED RELIABILITY

OF THE SOLDER JOINTS AND MAXIMUM

THERMAL CAPABILITY IT IS RECOMMENDED

THAT THE PAD BE SOLDERED TO THE

GROUND PLANE. THE GROUND PLANE

PATTERN SHOULD INCLUDE A PATTERN OF

VIAS TO INNER LAYERS.

Figure 77. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-8)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Package Description

Package Option

AD8260ACPZ-R71

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-8

AD8260ACPZ-RL1

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-8

AD8260ACPZ-WP1

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-8

AD8260-EVALZ1

Evaluation Board

1 Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D07192-0-5/08(0)

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