LTC2850/LTC2851/LTC2852

15

285012fe

For more information www.linear.com/LTC2850

PACKAGE DESCRIPTION

MSOP (MS) 0213 REV F

0.53 ±0.152

(.021 ±.006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 –0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

1 2 3 4 5

4.90 ±0.152

(.193 ±.006)

0.497 ±0.076

(.0196 ±.003)

REF

8

9

10

7 6

3.00 ±0.102

(.118 ±.004)

(NOTE 3)

3.00 ±0.102

(.118 ±.004)

(NOTE 4)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.10

(.201)

MIN

3.20 – 3.45

(.126 – .136)

0.889 ±0.127

(.035 ±.005)

RECOMMENDED SOLDER PAD LAYOUT

0.305 ±0.038

(.0120 ±.0015)

TYP

0.50

(.0197)

BSC

0.1016 ±0.0508

(.004 ±.002)

MS Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1661 Rev F)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

MSOP (MS8) 0213 REV G

0.53 ±0.152

(.021 ±.006)

SEATING

PLANE

0.18

(.007)

0.254

(.010)

1.10

(.043)

MAX

0.22 – 0.38

(.009 – .015)

TYP

0.1016 ±0.0508

(.004 ±.002)

0.86

(.034)

REF

0.65

(.0256)

BSC

0° – 6° TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

1 2 3 4

4.90 ±0.152

(.193 ±.006)

8 7 6 5

3.00 ±0.102

(.118 ±.004)

(NOTE 3)

3.00 ±0.102

(.118 ±.004)

(NOTE 4)

0.52

(.0205)

REF

5.10

(.201)

MIN

3.20 – 3.45

(.126 – .136)

0.889 ±0.127

(.035 ±.005)

RECOMMENDED SOLDER PAD LAYOUT

0.42 ± 0.038

(.0165 ±.0015)

TYP

0.65

(.0256)

BSC

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660 Rev G)

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.