R31DS0145EU0116 Rev. 1.16

Page 5

Sep 24, 2025

XK Datasheet

Thermal vias in the PCB pads can also be used to maximize performance. The vias act as “heat pipes” conducting

heat from the device to the PCB ground plane(s). For specific recommendations, contact Renesas.

Figure 3. Solder Re-flow Profile

Table 2. Thermal Characteristics—Customer PCB

Package

θJA (°C/W) [1]

1. Still air.

θJB (°C/W) [2]

2. Device soldered to 200 × 250 mm 10-layer PCB with one thermal via, and four PCB ground planes.

1814 Package (1612 footprint compatible)

94.4

56.7

2016 Package

97.6

61.1

2520 Package

76.7

40.4

3225 Package

76.8

42.6

Table 3. Package Mechanical Characteristics

Parameter

Test Method

Value

Mechanical Shock

Half-sine wave with 0.3ms 3000G. X, Y, Z each direction 1 time.

-

Mechanical Vibration

Frequency: 10 to 55MHz amplitude: 1.5mm.

Frequency: 55 to 2000Hz peak value: 20G.

Duration time: 4H for each X, Y, Z axis; total 12hours.

-

High Temp Operating Life (HTOL) 1000 hours at 125°C (under power).

-

MSL Level

JEDEC-STD-020E, Moisture/Reflow Sensitivity Classification for Non-

hermetic Surface Mount Devices, December 2014.

3

Pb-Free Reflow Profile

See Figure 3

-

tP

10 seconds Max within 5°C of

260°C peak

Ramp down not to

exceed 6°C/s

Ramp up 3°C/s Max

120 ±20 seconds in

pre-heating area

50 ±10

seconds

above 225°C

reflow area

400 seconds Max from +25°C to 260°C peak

25°C

160°C

180°C

225°C

260°C