R5F5671CDDFM datasheet(88/179 Pages) RENESAS

88 / 179 page

R01DS0373EJ0120 Rev.1.20

Page 88 of 179

Sep 30, 2024

RX671 Group

2. Electrical Characteristics

Note:

The values are reference values when the 4-layer board is used. Thermal resistance depends on the number of layers or size of

the board. For details, refer to the JEDEC standards.

Note 1. This value applies when the exposed die pad for this purpose is connected to VSS.

Table 2.10

Thermal Resistance Value (Reference)

Item

Package

Symbol

Max.

Unit

Test Conditions

Thermal resistance

144-pin LFQFP (PLQP0144KA-B)

ja

48.4

°C/W

JESD51-2 and

JESD51-7 compliant

100-pin LFQFP (PLQP0100KB-B)

51.7

64-pin LFQFP (PLQP0064KB-C)

51.2

48-pin HWQFN (PWQN0048KC-A)

19.1*1

145-pin TFLGA (PTLG0145JC-A)

30.9

JESD51-2 and

JESD51-9 compliant

145-pin TFLGA (PTLG0145KB-A)

30.6

100-pin TFLGA (PTLG0100JB-A)

30.9

64-pin TFBGA (PTBG0064KB-A)

32.0

144-pin LFQFP (PLQP0144KA-B)

jt

1.2

°C/W

JESD51-2 and

JESD51-7 compliant

100-pin LFQFP (PLQP0100KB-B)

1.2

64-pin LFQFP (PLQP0064KB-C)

1.2

48-pin HWQFN (PWQN0048KC-A)

0.1*1

145-pin TFLGA (PTLG0145JC-A)

0.4

JESD51-2 and

JESD51-9 compliant

145-pin TFLGA (PTLG0145KB-A)

0.4

100-pin TFLGA (PTLG0100JB-A)

0.4

64-pin TFBGA (PTBG0064KB-A)

0.4

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