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Table 2.44
Thermal Resistance
Parameter
Package
Symbol
Value*1
Unit
Test conditions
Thermal Resistance
176-pin HLQFP (PLQP0176K?-A)
θja
15
°C/W
JESD 51-2 and 51-7
compliant
224-pin BGA (PLBG0224J?-A)
21
JESD 51-2 and 51-9
compliant
289-pin BGA (PLBG0289J?-A)
20
303-pin BGA (PLBG0303G?-A)
17
176-pin HLQFP (PLQP0176K?-A)
Ψjt
0.3
°C/W
JESD 51-2 and 51-7
compliant
224-pin BGA (PLBG0224J?-A)
0.3
JESD 51-2 and 51-9
compliant
289-pin BGA (PLBG0289J?-A)
0.3
303-pin BGA (PLBG0303G?-A)
0.5
Note 1. The values are reference values when the 4-layer board is used. Thermal resistance depends on the number of layers or size of the
board. For details, see the JEDEC standards.
2.2.8.1
Calculation Guide of Maximum Current
Table 2.45
Power consumption of each unit (DCDC mode) (1 of 3)
Dynamic
current/
Leakage
current
MCU Domain
Category
Item
Symbol
Frequency
[MHz]
Current
[µA/MHz]
Current
[mA]
Condition
Leakage
current
Analog
Regulator and
Leak*1
Tj = 95°C
ICC
—
—
2.51
—
Tj = 105°C
—
—
2.91
Tj = 115°C
—
—
3.45
Tj = 125°C
—
—
4.15
Tj = 95°C
ICC_DCDC
—
—
186
VCC_DCDC =
3.3 V,
VSCR_1,
PDCTRESWM
.PDDE = 0
Tj = 105°C
—
—
216
Tj = 115°C
—
—
243
Tj = 125°C
—
—
277
Tj = 95°C
—
—
363
VCC_DCDC =
1.8 V,
VSCR_1,
PDCTRESWM
.PDDE = 0
Tj = 105°C
—
—
421
Tj = 115°C
—
—
474
Tj = 125°C
—
—
540
Tj = 95°C
IDD
—
—
477
VSCR_1,
PDCTRESWM
.PDDE = 0
Tj = 105°C
—
—
553
Tj = 115°C
—
—
622
Tj = 125°C
—
—
709
RA8M2 Datasheet
2. Electrical Characteristics
R01DS0438EJ0130 Rev.1.30
Feb 27, 2026
Page 105 of 295



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