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AS7225 bảng dữ liệu(HTML) 10 Page - ams-OSRAM AG

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AS7225
Absolute Maximum Ratings
Datasheet
• PUBLIC
DS000496
• v2-00 • 2019-Jun-28
75
│ 9
4
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only. Functional operation of the device at these or any other
conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability. The device is not
designed for high-energy UV (ultraviolet) environments, including upward looking outdoor applications,
which could affect long-term optical performance. All voltages with respect to GND. Device
parameters are guaranteed at VDD = 3.3 V and TAMB = 25 °C unless otherwise noted.
Figure 5
Absolute Maximum Ratings of AS7225
Symbol
Parameter
Min
Typ
Max
Unit
Comments
Electrical Parameters
VDD1_MAX
Supply Voltage VDD1
-0.3
5
V
Pin VDD1 to GND
VDD2_MAX
Supply Voltage VDD2
-0.3
5
V
Pin VDD2 to GND
VDD_IO
Input/Output Pin
Voltage
-0.3
VDD +
0.3
V
Low Voltage pins to
GND
ISCR
Input Current (latch-up
immunity)
± 100
mA
JESD78D
Electrostatic Discharge
ESDHBM
Electrostatic Discharge
HBM
± 1000
V
JS-001-2014
ESDCDM
Electrostatic Discharge
CDM
± 500
V
JEDEC JESD22-
C101F Oct 2013
Temperature Ranges and Storage Conditions
TSTRG
Storage Temperature
Range
-40
85
°C
TBODY
Package Body
Temperature
260
°C
IPC/JEDEC J-STD-
020 (1)
RHNC
Relative Humidity (non-
condensing)
5
85
%
MSL
Moisture Sensitivity
Level
3
Represents a 168-
hour max. floor
lifetime.
Bump Temperature (soldering)
TPEAK
(1)
Peak Temperature
235
245
°C
Solder Profile
(1)
The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices.” The lead finish for
Pb-free leaded
packages is “Matte Tin” (100 % Sn)



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