AS1130-BSST datasheet(7/67 Pages) AMSOSRAM

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AS1130 − Absolute Maximum R atings

Stresses beyond those listed in Absolute Maximum Ratings may

cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any

other conditions beyond those indicated in Electrical

Characteristics is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device

reliability.

Figure 6:

Absolute Maximum Ratings

Note(s):

1. The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Nonhermetic Solid State Surface Mount Devices”.

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD to GND

-0.3

All other pins to GND

-0.3

7 or

VDD + 0.3

Sink Current

500

Segment Current

100

Input Current (latch-up

immunity)

-100

100

JEDEC 78

Electrostatic Discharge

(human body model)

±2

MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Junction Temperature

150

ºC

Storage Temperature

Range

-55

125

ºC

For 20-Pin WL-CSP

-55

150

ºC

For 28-pin SSOP/TSSOP

Package Body

Temperature

260

ºC

28-pin

SSOP/

TSSOP

IPC/JEDEC J-STD-020(1)The lead

finish for Pb-free leaded packages

is matte tin (100% Sn).

20-Pin

WL-CSP

IPC/JEDEC J-STD-020(1)

Relative Humidity

(non-condensing)

585

Moisture Sensitivity Level

20-Pin

WL-CSP

Represents an unlimited floor life

time

28-pin

SSOP/

TSSOP

Represents a max. floor life time of

168h

Absolute Maximum Ratings

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